NM E-Binder 3070
Low viscosity epoxy resin primarily for the manufacture of heat-resistant tools and molds.
NM ME 585
NM ME 585 is a low viscosity, room temperature curing solvent free epoxy resin with all-round properties, i.e. modelling and production of moulds.
NM ME 585 can be used for laminating as well as adhesive. It can be filled with sand or aluminium powder for backing. NM ME 585 has a friendly environment profile, and contains no un-reactive products labelled as hazardous to the environment. NM ME 585 has a quite long pot life, and produce very little heat build-up. It can be accelerated up to 10% with NM Accelerator 254. NM ME 585 can be thixotropated with NM Filler 51 for the use as adhesive. The wetting is good to most substrates.