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NM ME 585
A low viscosity, room temperature curing, solvent free epoxy resin with all-round properties, i.e. modelling and production of moulds.
Can be used for laminating as well as adhesive. It can be filled with sand or aluminium powder for backing. NM ME 585 has a quite long pot life, and produce very little heat build-up.
Can be thixotropated with NM Filler 51 for the use as adhesive. The wetting is good to most substrates.